SÜSS MicroTec

Congratulations: Dr. Winfried Süss celebrates his 90th birthday. 🎈 Today Dr. Winfried Süss, son of our company founder Karl Süss and long-standing Managing Director and Chairman of the Supervisory Board of SÜSS MicroTec, turns 90. Shortly before his milestone birthday, Burkhardt Frick, CEO of SÜSS MicroTec, and Dr. David Dean, Chairman of the Supervisory Board of SÜSS MicroTec, visited Dr. Winfried Süss at home. ⤵️ Wearing a light blue shirt, blue checked jacket and a smile, Dr. Winfried Süss opens the door when the doorbell rings. The table in the dining room is set for coffee and cake. Memorabilia and documents from the past, including the brochure celebrating the company's 50th anniversary in 1999, lie on the table. 🔵 For Dr. Winfried Süss, the visit is a trip down memory lane, back to the time when his father and later he and his older brother Ekkehard ran the Karl Süss company together. 🔵 For Burkhardt Frick and Dr. David Dean, on the other hand, it is a matter of course to pay a visit to the long-standing Managing Director and Chairman of the Supervisory Board shortly before his 90th birthday. The relocation from Munich city center to Garching, the expansion to America, successful and less successful product developments, the death of his brother and father, the handover of his CEO position and the assumption of the new post as Chairman of the Supervisory Board, the IPO in 1999 and the retirement in 2008 at the age of 74 – Dr. Süss brought the past to life during this visit. The opportunity to meet Dr. Winfried Süss and hear his stories first-hand was both exciting and inspiring for Burkhardt Frick and Dr. David Dean. We would like to thank Dr. Winfried Süss for his tireless efforts and wish him a happy 90th birthday! 🎈 #sussmicrotec #semiconductor #innovation #leadership #jubiläum 

The Annual General Meeting is shareholder democracy.  ⤵️ Yesterday, we welcomed around 75 shareholders to the 2024 Annual General Meeting in Munich. Nearly 50% of the share capital was present. We support the direct exchange between companies and owners, between the management board and private investors. No other event in the year offers a similar format. A format in which you can express criticism, ask questions and get answers. As a face-to-face event, this is even more direct and personal than in the virtual world.    Many thanks to everyone who made the trip to Munich yesterday.  #sussmicrotec #semiconductor

One tool – four options: our new ECD8! The ECD8 is an enhanced platform that opens up a wide range of applications. It is available as semi-automated coater or developer and can be perfectly customized as  ➡ open-bowl spin coater  ➡ spin coater with GYRSET® cover  ➡ spin coater with air barrier plate  ➡ puddle developer tool    Thanks to its versatility the ECD8 is perfect for use in R&D as well as series production. With the multitude of variants and configurations available, substrates from 2" to 200mm as well as square ones up to 6" edge length can be coated or developed on the ECD8. Curious? More details on our website https://lnkd.in/dmmZvdK9   #sussmicrotec #coater #developer #semiconductor

The Electronics Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education. SÜSS MicroTec is a long-time sponsor and participant of this conference. Marc Hennemeyer, Director Process Technology Lithography, was on site together with colleagues and shared his insights with us: ⤵️ A major focus of this year’s event was on the development of 𝗵𝗲𝘁𝗲𝗿𝗼𝗴𝗲𝗻𝗲𝗼𝘂𝘀 𝗽𝗮𝗰𝗸𝗮𝗴𝗲𝘀. Of course, for this reason it is great that this year's event was attended by our most important packaging customers as well as by research institutes. It was a fantastic opportunity to learn what our customers target to do in the next 3 to 5 years.  ➡️ Let's take a closer look at the main topic of ‘heterogeneous packages’. Such packages contain different types of chips on a larger substrate. They can be seen as a further development of fan-out packaging, for which we have been offering our solutions for many years. An example of a heterogeneous package: modern high-performance computer systems. In such a package, processor chips are combined with memory chips. The close integration of these very different chip types enables higher data rates than in the past and is essential for the further development of AI hardware. In a nutshell: With over 1500 participants and more than 260 presentations, the #ECTC2024 was an excellent place to get in touch with important customers and research partners. Marc Hennemeyer summarises: “What I personally like best about the ECTC is the focus on technology discussions. The mindset of the participants is generally very open and innovation-orientated. This allows for discussions during the breaks that really help to understand the technology and the challenges from our customers' perspective.” #sussmicrotec #semiconductor 

Time travelling through our company’s history (part 4/4). ⤵️ The semiconductor industry is constantly evolving... To stay ahead, companies must make strategic decisions about their technology focus and business operations. We have navigated the changes in the industry for many years through acquisitions and global expansion. 𝗠𝗶𝗹𝗲𝘀𝘁𝗼𝗻𝗲𝘀 𝗼𝗳 𝘁𝗵𝗲 𝗹𝗮𝘀𝘁 𝟮𝟰 𝘆𝗲𝗮𝗿𝘀 𝗶𝗻 𝗮 𝗻𝘂𝘁𝘀𝗵𝗲𝗹𝗹: 🔵 By the acquisition of Fairchild Technologies, we gained access to high-end markets with production coaters in 2000.   🔵 In 2006 we established the spin-off SUSS MicroTec Reman in the flourishing used equipment market.  🔵 We acquired Hamatech APE for photomask processing equipment and consolidated substrate bonding production in our new Sternenfels facility in 2010.  🔵 The 2012 Tamarack Scientific acquisition added advanced laser patterning to our lithography capabilities.  🔵 With digitization fueling microstructuring demand, we increased our production capacities by expansion of our Taiwanese branch in 2020. A new production facility was added to the sales and service office which had been established in 2001.  🔵 Also in 2020, we added inkjet printing solutions to our portfolio by the acquisition of PiXDRO.    We have sharpened our technology focus and deliver innovative solutions that fulfil the needs of our customers today and tomorrow. For the time being, this is the last post in our journey into the past of SÜSS MicroTec.   🙌🏼 Of course, we are not only proud of our past, but excited about what the future holds! What did you like best about our four-part journey into the past of SÜSS MicroTec? Tell us about it in the comments.   #sussmicrotec #semiconductor #innovation

🗓️ We've got an exciting June ahead with several top events offering great chances to share knowledge and connect:    ➡️ Hilton Head Workshop  ➡️ NanoSpain  ➡️ The Future of Electronics Reshaped  ➡️ UGIM  ➡️ Leti Days  ➡️ Graphene 2024    You can find all the information about the events in the PDF slider, just click through.    Feel free to share this post with anyone who needs to know about these events.    Which of you will we meet at one of the events?  Let us know in the comments.    #sussmicrotec #EnablingSemiconductorInnovations 

In the nineties, our company changed its corporate structure profoundly. A family business became a stock corporation. (part 3/4) ➡️ In 1994, company founder Karl Süss and his eldest son Ekkehard Süss died in quick succession. This led to a reorganisation. ➡️ In 1998, Karl Süss GmbH was converted into a German public limited company and renamed Süss MicroTec AG.   ➡️ In 1999, share placement and IPO followed. The company has been listed at the Frankfurt Stock Exchange ever since. The semiconductor industry was still constantly evolving! ️ And that's exactly what next week's part 4/4 will be about. After the turn of the millennium, we seized opportunities that the industry offered.  

We used the International Semiconductor Executive Summits (ISES) in Taiwan as an opportunity to present our hybrid bonding platform XBC300 Gen2 D2W/W2W to the public for the first time as part of our portfolio. Robert Wanninger, SVP Advanced Backend Solutions at SUSS MicroTec, was on site and provides us with an insight into the event. We asked him three questions: 1️⃣  What was your ISES Taiwan 2024 highlight? → ISES is a gathering of senior executives in semiconductor manufacturing. It is limited to decision makers and decision influencers and offers benefits such as networking with government officials and senior semiconductor manufacturers, identifying opportunities to enter or expand partnerships, learning what the primary market and government are planning for the future of semiconductor manufacturing and more. Taiwan plays an important role in the semiconductor industry, which makes this event an excellent mix of market and technology topics.    2️⃣  What did you talk about most with the other participants?   → About the importance of high-performance computing and advanced packaging for the growth of Artificial Intelligence. 3️⃣  An important part of your presentation ‘State-of-the art solutions for W2W and D2W hybrid bonding’ was dedicated to the XBC300 Gen2 D2W/W2W, our new hybrid bonding all-rounder. How was the expansion of our portfolio received?  → Very good, I got a lot of positive feedback. The presentation was perceived as inspiring. I emphasized that SUSS MicroTec’s hybrid bonding solutions offer unique technological advantages for outstanding process performance and that we are optimizing our product solutions to meet our customers’ equipment and manufacturing needs. It has been confirmed to me that SUSS MicroTec is transforming from a hidden champion to a real player in the semiconductor industry. In the field of bonding systems, but not only there. 🗓️️ By the way, ISES EU Power 2024 will take place in Porto, Portugal, from June 25 – 26, 2024. It’s the next opportunity to meet Robert Wanninger and SUSS MicroTec. #sussmicrotec #semiconductor #innovation #ai #tises2024 

It was a matter of honor for us to take part in ITF World 2024, imec’s flagship event of the year.    Our COO Thomas Rohe, Senior Vice President Advanced Packaging Solutions Robert Wanninger and Senior Vice President R&D Stefan Lutter were on site as imec celebrated 40 years of nanotech innovation.    As a long-time imec partner, we are proud to help shape the chips and processes of tomorrow.     For 15 years, we've collaborated with this renowned nano- and microelectronics research center to push the boundaries of what's possible. Our joint development programs focus on 3D chip integration and lithography - including EUV (extreme ultraviolet) patterning.    Together, we're advancing key technologies like:  ➡️ EUV photomask cleaning: optimizing this process for our next-gen products ➡️ Temporary bonding: developing and qualifying processes now used in customer production  ➡️ Hybrid bonding: our XBS300 and XBA module leverage our joint innovations     By pooling our expertise with pioneers like imec, we're able to achieve more, faster. Our partnerships accelerate R&D and feed cutting-edge solutions into our portfolio. Ultimately, this gives our customers the opportunity to access the latest technology more quickly.     #sussmicrotec #semiconductor #innovation #ITFWorld2024 #imec40years 

Do you know what a bonder is? ⤵️   You often hear this term in the semiconductor and electronics industry. For all industry experts, the term is probably clear. Others certainly have question marks in their heads.   Bonding is about joining materials together temporarily or permanently to produce complex electronic components.  A bonder is a machine or system that carries out these joining processes. It enables two  wafers  to be joined together reliably with a micro or even nano scale precision. 📲 This is crucial to produce electronic devices. Without them, there would be no smartphones, computer chips or other electronic products as we know them.   To join the different material combinations various bonding technologies can be used depending on the application and the requirements of the end product. Key parameters during the bonding process are the applied bond force, the processing time as well as the temperature. ➡️ The bonders of SÜSS MicroTec are used in the manufacturing process of electronic components to create necessary multi-layer structures with different materials.   Here is another abstract example to make it even clearer:    Imagine a multi-layer cake. 😉 At the bottom you have the baked base, followed by a delicious fruit layer, then a generous layer of cream and finally a chocolate icing.   Each layer is important, but they also need to be perfectly connected so that the cake holds together and doesn't break apart.     💬 Do you have any other suggestions on how to explain bonding technology simply? Feel free to write them in the comments. #sussmicrotec #semiconductor